packaging technology
英 [ˈpækɪdʒɪŋ tekˈnɒlədʒi]
美 [ˈpækɪdʒɪŋ tekˈnɑːlədʒi]
网络 封装技术; 包装技术; 封装工艺; 包装技术部; 包装工艺学
双语例句
- The evolution of modern American take-out is a fascinating convergence of social history and packaging technology.
美国现代外卖食品的发展是社会历史和包装技术的一种奇妙结合。 - And packaging technology through constant innovation, personality and the pursuit of the trend for new and old customers with perfect service.
并通过不断的创新，追求个性和潮流，为新老客户提供尽善尽美的服务。 - Global Semiconductor Packaging Materials Outlook is a comprehensive market research study that examines semiconductor packaging technology trends and their impact on the packaging materials markets.
全球半导体封装材料市场展望报告全面调研了半导体封装工艺趋势记忆其对封装材料市场的影响。 - Thus, by optimized the process and packaging technology can make thin film polarizing beam splitter to reach the application requirements.
由此可见，通过优化镀制工艺和封装工艺可以使薄膜偏振分束镜的指标达到使用要求。 - On the Development of China Military Equipment Packaging Application of Integrated Protection Packaging Technology in Ordnance
我国军用器材防护包装技术发展探析综合防护包装技术在武器装备中的应用 - As such, from an architectural perspective, OSGi is just a specific packaging technology.
这样，从一个架构的角度来，OSGi只是一个特殊的封装打包技术。 - Influence of Military Packaging Technology Development on Military Logistics Effect of Integration on Armyman Suicide
军用包装技术的发展对军事物流的影响综合干预对某部军事人员自杀的影响 - Advanced grain-protection technology should be applied and new packaging technology and materials adopted for grain storage.
广应用先进保粮技术，运用新的包装技术和包装材料； - Flip Chip will be a New Method of Packaging Technology
倒装芯片将成为封装技术的最新手段 - Due to the increasing demand for higher output powers, we focus mainly on gold-tin mounted laser bars and show their great potential in comparison to the standard indium packaging technology.
由于高功率输出需求的不断增加，我们主要集中在安装激光棒的金锡焊料和研究其与标准的铟封装技术相比的巨大的潜能。 - Study on Robustness Improved ESD Protection Method by Capacitive Packaging Technology
采用容性封装技术提高ESD防护性能研究 - Development of new packaging technology for liquid-fill products.
为液体填装产品开发新的包装技术。 - The COF/ MEMS packaging technology is well-suited for many microsystem packaging applications such as micro-optics and radio frequency ( RF) devices.
COF/MEMS封装技术非常适合于诸如微光学及无线射频器件等很多微系统封装的应用。 - Application of modified atmosphere packaging technology in chilled meat preservation Preservative Effects of Various Chemical Decontamination Treatments on Broiler Chicken Cuts During Refrigerated Storage
气调包装技术在冷鲜肉中保鲜的应用化学减菌处理对冰鲜鸡肉的保鲜效果 - Modified atmosphere packaging is a new packaging technology which excels the traditional vacuum packaging and high temperature sterilization packaging.
气调保鲜包装是针对真空包装和高温灭菌等传统包装方法带来的不足而研发的新型包装技术。 - The New Evolution of Consumer Electronics and Application of Packaging Technology
消费电子产品发展趋势及封装技术的应用 - Random packaging design devoid of conformability affects the advance of packaging technology and its value positioning in economic development as well as the enforcement of the strategies for continued development.
摘要缺乏整合性的无序包装设计状态，既不利于包装科技的发展，也影响了包装业在经济建设中的价值定位及可持续发展战略实施。 - COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。 - Application of Integrated Protection Packaging Technology in Ordnance
综合防护包装技术在武器装备中的应用 - Influence of Fluorescent Glue Packaging Technology on the Color Rendering Index of High Power LED To form the images, one simply projects laser light through the developed film.
大功率LED荧光胶封装工艺对其显色性能的影响为了显象、我们只要使激光射过已显影的胶片就可。 - The Research of the Effect of Nanocomposite Packaging Technology on Supermarket Steamed Bread and Dishes
超市面点、盘菜纳米保鲜包装技术的应用研究 - The mechanism of food preservation and the characteristics of intelligent packaging technology were analyzed.
智能包装可以更好的对食品起到保鲜作用，已成为包装界关注的焦点。 - IC manufacturing faced the challenges of physical limits, 3D packaging technology has increasingly become the focus of the microelectronics industry.
在IC制造技术受到物理极限挑战的今天，3D封装技术越来越成为了微电子行业关注的热点。 - The Production and Packaging Technology of Wet Raw Noodles
生湿鲜面条的规模化生产及其包装技术初探 - An Investigation of Reactive Ion Etching for Through Silicon Via Packaging Technology
反应离子刻蚀在穿透硅通孔封装技术中的应用研究 - The Krones Group, with its headquarters in Neutraubling, Germany, develops and manufactures machines and complete lines for all areas of filling and packaging technology.
克朗斯集团公司总部设在德国的新特劳普林，开发、制造用于灌包装技术各领域的机器及全套生产线。 - The rapid development of electronic packaging technology has led to strict requirement for packaging materials.
电子封装技术的快速发展对封装材料的性能提出了更为严格的要求。 - This demand enormously impels the development of semiconductor IC packaging technology.
正是这种旺盛的需求极大推动了半导体IC封装技术的发展。 - Modularization, multi-thread design and Active Control Packaging Technology are widely used in this system.
整个系统的软件方面采用了模块化设计、多线程设计、Active控件的封装技术。 - In packaging technology, the study primarily for on-line packed in the design and application programming.
在包装的技术方面，主要对于在线包装在节目制作的设计和应用进行研究。